Dr. Preeti Chauhan

Technical Program Manager, Google

Dr. Preeti Chauhan is currently a Technical Program Manager (TPM) in the Data Center Quality and Reliability group at Google. Previously, Dr Chauhan was a Quality and Reliability TPM at Intel and led the Assembly and Test certification of Foveros 3D packaging technology and Server microprocessors. She is a senior member of IEEE, currently serving as co-editor of the data column in the Computer magazine. Preeti is also an active member of IEEE Reliability Society, representing the society in the IoT initiative. In 2020 she served as vice president of RS Technical Activities and was an RS AdCom member from 2018-2020.

Dr Chauhan received her PhD in Mechanical Engineering from University of Maryland, where her research focused on lead-free solder interconnect reliability. She is a recipient of the 2019 Intel Achievement Award for her contributions to the development of the industry’s first 3D packaging technology for Intel processors and the 2017 Early Career Award from the James Clark School of Engineering at the University of Maryland, College Park, in recognition of her professional achievements. She has authored a book on Copper Wire Bonding, and published 20+ articles in peer-reviewed journals and conferences in the areas of electronic packaging reliability and Prognostic Health Management.